Invention Grant
- Patent Title: Semiconductor devices, packaging methods and structures
- Patent Title (中): 半导体器件，封装方法和结构
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Application No.: US13194606Application Date: 2011-07-29
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Publication No.: US08916969B2Publication Date: 2014-12-23
- Inventor: Yu-Ren Chen , Ming Hung Tseng , Yi-Jen Lai
- Applicant: Yu-Ren Chen , Ming Hung Tseng , Yi-Jen Lai
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/16 ; H01L23/00 ; H01L23/31 ; H01L21/56
Abstract:
Semiconductor devices, packaging methods and structures are disclosed. In one embodiment, a semiconductor device includes an integrated circuit die with a surface having a peripheral region and a central region. A plurality of bumps is disposed on the surface of the integrated circuit die in the peripheral region. A spacer is disposed on the surface of the integrated circuit die in the central region.
Public/Granted literature
- US20130026623A1 Semiconductor Devices, Packaging Methods and Structures Public/Granted day:2013-01-31
Information query
IPC分类:
