The present invention relates to a heat sink (1), which is in thermal connection with at least one electronic component (4). The heat sink (1) has at least one chamber (2), which has at least one wall with at least one porous element (3a). Pressure producing means (7) are connected to the chamber (2), in order to cyclically modulate the air pressure P1 in the chamber (2). Thus, a “breathing” of air through the at least one porous element (3a) can be achieved and a cooling effect is obtained. Additionally, holes (8) can be provided to the chamber (2), which produce cyclic air jets (9) due to the fluctuating chamber air pressure P1. By providing an interaction of the air jets (9) with the air volume surrounding the at least one porous element (3a), the cooling of the at least one electronic component (4) can be optimized