Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method thereof, and electronic apparatus
- Patent Title (中): 固态成像装置及其制造方法以及电子装置
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Application No.: US13317465Application Date: 2011-10-19
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Publication No.: US08917338B2Publication Date: 2014-12-23
- Inventor: Yoichi Otsuka , Akiko Ogino
- Applicant: Yoichi Otsuka , Akiko Ogino
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2010-274895 20101209
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N5/335 ; H04N9/04 ; H01L21/00 ; H04N9/64 ; H01L27/146

Abstract:
A solid-state imaging device includes a light blocking layer formed in an active pixel region of a pixel region on a light incident side so as to surround a photoelectric conversion unit of each pixel and formed in an extending manner to an optical black region, a concave portion formed so as to be surrounded by the light blocking layer in a region corresponding to the photoelectric conversion unit, a first refractive index layer formed on surfaces of the light blocking layer and the concave portion and having a relatively low refractive index, a second refractive index layer formed on the first refractive index layer so as to be buried in the concave portion and having a relatively high refractive index, and an anti-flare layer formed on the first refractive index layer in the optical black region.
Public/Granted literature
- US20120147208A1 Solid-state imaging device, manufacturing method thereof, and electronic apparatus Public/Granted day:2012-06-14
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