A wiring structure between main body and cover body of electronic device includes a support connection member. The support connection member has a first pivoted section pivotally connected to the cover body and a second pivoted section pivotally connected to the main body. The first pivoted section is formed with a first pivot hole communicating with outer side. The second pivoted section is formed with a second pivot hole communicating with outer side. The support connection member is formed with a recessed receiving space between the first and second pivoted sections in communication with the first and second pivot holes. At least one conductive body is disposed in the receiving space. The conductive body has a first connection end and a second connection end respectively outward extending from the first and second pivot holes. A protection cover board is disposed in the receiving space for covering the conductive body.