Invention Grant
- Patent Title: Constructing very high throughput long training field sequences
- Patent Title (中): 构建非常高吞吐量的长训练场序列
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Application No.: US13775796Application Date: 2013-02-25
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Publication No.: US08917785B2Publication Date: 2014-12-23
- Inventor: Didier Johannes Richard Van Nee , Lin Yang , Hemanth Sampath
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Eric Ho
- Main IPC: H04K1/10
- IPC: H04K1/10 ; H04L27/28 ; H04L27/26
Abstract:
Certain aspects of the present disclosure relate to techniques for constructing a long training field (LTF) sequence in a preamble to reduce a peak-to-average power ratio (PAPR) at a transmitter.
Public/Granted literature
- US20130242963A1 CONSTRUCTING VERY HIGH THROUGHPUT LONG TRAINING FIELD SEQUENCES Public/Granted day:2013-09-19
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