Invention Grant
- Patent Title: Sample support structure and methods
- Patent Title (中): 样品支持结构和方法
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Application No.: US12515131Application Date: 2007-11-16
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Publication No.: US08920723B2Publication Date: 2014-12-30
- Inventor: John Damiano, Jr. , Stephen E. Mick , David P. Nackashi
- Applicant: John Damiano, Jr. , Stephen E. Mick , David P. Nackashi
- Applicant Address: US NC Raleigh
- Assignee: Protochips, Inc.
- Current Assignee: Protochips, Inc.
- Current Assignee Address: US NC Raleigh
- Agency: Moore & Van Allen, PLLC
- Agent Tristan A. Fuierer
- International Application: PCT/US2007/084945 WO 20071116
- International Announcement: WO2008/061224 WO 20080522
- Main IPC: G01N15/06
- IPC: G01N15/06 ; G01N23/04 ; H01J37/20 ; G01N27/416 ; B82Y10/00 ; B82Y30/00 ; G01N27/30 ; G01N27/06 ; G01N27/333 ; B82Y40/00

Abstract:
A sample support structure comprising a sample support manufactured from a semiconductor material and having one or more openings therein. Methods of making and using the sample support structure.
Public/Granted literature
- US20100143198A1 SAMPLE SUPPORT STRUCTURE AND METHODS Public/Granted day:2010-06-10
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