Invention Grant
- Patent Title: Probe card and method for manufacturing probe card
- Patent Title (中): 探针卡和制造探针卡的方法
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Application No.: US14067685Application Date: 2013-10-30
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Publication No.: US08922234B2Publication Date: 2014-12-30
- Inventor: Akinori Shiraishi , Hideaki Sakaguchi , Mitsutoshi Higashi
- Applicant: Shinko Electric Industries Co., Ltd.
- Applicant Address: JP Nagano-ken
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-ken
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2010-098013 20100421
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R1/073 ; H05K3/40

Abstract:
A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.
Public/Granted literature
- US20140055157A1 PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD Public/Granted day:2014-02-27
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