Invention Grant
- Patent Title: Ultra-compact headset
- Patent Title (中): 超小型耳机
-
Application No.: US13342090Application Date: 2012-01-01
-
Publication No.: US08923524B2Publication Date: 2014-12-30
- Inventor: David E. Wise , Nikhil Jain
- Applicant: David E. Wise , Nikhil Jain
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H02B1/00 ; H04R3/00 ; H04M1/00

Abstract:
An ultra-compact headset device including both speaker and microphone capability in at least one earphone overcomes the minimum size requirements of previous headsets by controlling the speaker and microphone functionality so that each earphone functions either as a speaker or microphone, but never both at the same time. Various embodiment headsets may include a pair of earphones each with one or more transducers capable of converting electrical signals into sound and vice versa. The ultra-compact headset may be wirelessly coupled to a mobile device, such as a cellular telephone or smart phone.
Public/Granted literature
- US20130170665A1 ULTRA-COMPACT HEADSET Public/Granted day:2013-07-04
Information query