Invention Grant
- Patent Title: Volumetric cut planning
- Patent Title (中): 容量切割计划
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Application No.: US13226595Application Date: 2011-09-07
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Publication No.: US08923999B2Publication Date: 2014-12-30
- Inventor: Theo Balkenende , Hans Scheerder , Oliver Sing , Tom van 't Erve
- Applicant: Theo Balkenende , Hans Scheerder , Oliver Sing , Tom van 't Erve
- Applicant Address: US TX Plano
- Assignee: Siemens Product Lifecycle Management Software Inc.
- Current Assignee: Siemens Product Lifecycle Management Software Inc.
- Current Assignee Address: US TX Plano
- Main IPC: G05B19/4097
- IPC: G05B19/4097 ; G05B19/4069

Abstract:
Methods for computer-aided manufacturing and design, and corresponding systems and computer-readable mediums. A method includes receiving a three-dimensional (3D) solid part model and an associated 3D solid blank. The method includes defining an initial in-process workpiece (IPW) as the same as the 3D solid blank, and defining a cut volume in-process feature to be removed from the IPW. The method includes removing the cut volume in-process feature from the IPW. The method can include calculating and storing the cut volume in-process feature or the updated IPW with the removed cut volume in-process feature. The updated in-process workpiece can be calculated and displayed for each state at all times, in various embodiments.
Public/Granted literature
- US20130060368A1 VOLUMETRIC CUT PLANNING Public/Granted day:2013-03-07
Information query
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