Invention Grant
- Patent Title: Component mounting apparatus
- Patent Title (中): 组件安装设备
-
Application No.: US12824707Application Date: 2010-06-28
-
Publication No.: US08925188B2Publication Date: 2015-01-06
- Inventor: Toru Nishino , Kazuyuki Ikura
- Applicant: Toru Nishino , Kazuyuki Ikura
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-154106 20090629
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K3/30

Abstract:
A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.
Public/Granted literature
- US20100325884A1 MOUNTING APPARATUS AND MOUNTING METHOD Public/Granted day:2010-12-30
Information query