Invention Grant
- Patent Title: Modular house building system
- Patent Title (中): 模块化房屋建筑系统
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Application No.: US13607738Application Date: 2012-09-09
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Publication No.: US08925283B2Publication Date: 2015-01-06
- Inventor: Luc Lemieux
- Applicant: Luc Lemieux
- Priority: GB0922138.3 20091218
- Main IPC: E04B1/00
- IPC: E04B1/00 ; E04B1/10 ; E04B5/12

Abstract:
A modular house building system has floor module supports; floor modules; wall modules; window panel modules; door panel modules; and fasteners, wherein the modules are connected to one another in any of a number of configurations using the fasteners to form a chosen modular house configuration; wherein the wall, window panel, and door panel modules each include horizontal planks, vertical planks that define an outer perimeter of each the module, and interstitial planks connected between the vertical planks that are used to increase the strength of each the module, and are connected together in any one of a plurality of configurations to form each respective module in a pre-chosen dimension and configuration.
Public/Granted literature
- US20130055654A1 Modular house building system Public/Granted day:2013-03-07
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