Invention Grant
- Patent Title: Flexible grip die-alignment arrangement
- Patent Title (中): 柔性手柄芯片对准布置
-
Application No.: US12924139Application Date: 2010-09-21
-
Publication No.: US08925435B2Publication Date: 2015-01-06
- Inventor: Richard J. Greenleaf
- Applicant: Richard J. Greenleaf
- Agent Don Halgren
- Main IPC: B26D7/26
- IPC: B26D7/26 ; B21D45/08 ; B23P11/02 ; B21D28/26 ; B21D28/34 ; B26D7/18 ; B26F1/40

Abstract:
A solid tool gripping and alignment plate, for accurately gripping and holding a tool placed therein in perfect alignment. The tool gripping and alignment plate consists of a flat unitary tool gripping plate with a smooth non-circular opening formed in the tool gripping plate for gripping a tool therein fully 360 degrees about a tool's periphery upon adjustment of the gripping plate. A single threaded adjustment member is arranged through a side of the gripping plate for biasing a portion of the smooth non-circular opening in the tool gripping plate from a non-circular shape into the circular shaped opening for circumferentially gripping of a tool therein.
Public/Granted literature
- US20110067538A1 Flexible grip die-alignment arrangement Public/Granted day:2011-03-24
Information query