Invention Grant
- Patent Title: Composition for forming film
- Patent Title (中): 成膜用组合物
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Application No.: US14003478Application Date: 2012-04-04
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Publication No.: US08925626B2Publication Date: 2015-01-06
- Inventor: Keiichi Akinaga , Tadashi Okawa , Kazuhiro Nishijima , Eiji Kitaura
- Applicant: Keiichi Akinaga , Tadashi Okawa , Kazuhiro Nishijima , Eiji Kitaura
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Dow Corning Toray Co., Ltd.
- Current Assignee: Dow Corning Toray Co., Ltd.
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2011-086275 20110408
- International Application: PCT/JP2012/059835 WO 20120404
- International Announcement: WO2012/137977 WO 20121011
- Main IPC: C09D5/00
- IPC: C09D5/00 ; C09D183/04 ; F28F3/00 ; C08L83/04 ; C08G77/08 ; C08G77/12 ; F28F19/02
Abstract:
A substrate is surface treated using a composition for forming a film that comprises (A) an organoalkoxysilane, (B) an organopolysiloxane having a silicon-bonded hydrogen atom, and (C) a condensation reaction catalyst. This composition for forming a film can form a highly hydrophobic water repellent film provided with sufficient water shedding performance. It is possible to provide a highly hydrophobic substrate such as a heat dissipating body.
Public/Granted literature
- US20130340992A1 Composition For Forming Film Public/Granted day:2013-12-26
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