Invention Grant
- Patent Title: Diamond bonded construction with reattached diamond body
- Patent Title (中): 金刚石粘结结构与重新附着的钻石体
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Application No.: US12903081Application Date: 2010-10-12
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Publication No.: US08925656B2Publication Date: 2015-01-06
- Inventor: Yuelin Shen , Youhe Zhang
- Applicant: Yuelin Shen , Youhe Zhang
- Applicant Address: US TX Houston
- Assignee: Smith International, Inc.
- Current Assignee: Smith International, Inc.
- Current Assignee Address: US TX Houston
- Agency: Snell & Wilmer L.L.P.
- Main IPC: E21B10/36
- IPC: E21B10/36 ; E21B10/46 ; E21B10/567 ; B22F7/06 ; B24D99/00 ; C22C26/00 ; B22F5/00

Abstract:
Diamond bonded construction comprise a diamond body attached to a support. In one embodiment, an initial substrate used to sinter the body is interposed between the body and support, and is thinned to less than 5 times the body thickness, or to less than the body thickness, prior to attachment to the support to relieve stress in the body. In another embodiment, the substrate is removed after sintering, and the body is attached to the support. The support has a material construction different from that of the initial substrate, wherein the initial substrate is selected for infiltration and the support for end use properties. The substrate and support include a hard material with a volume content that may be the same or different. Interfaces between the body, substrate, and/or support may be nonplanar. The body may be thermally stable, and may include a replacement material disposed therein.
Public/Granted literature
- US20110083909A1 Diamond Bonded Construction with Reattached Diamond Body Public/Granted day:2011-04-14
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