Invention Grant
- Patent Title: Method for making a solder joint
- Patent Title (中): 制造焊点的方法
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Application No.: US13663698Application Date: 2012-10-30
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Publication No.: US08925793B2Publication Date: 2015-01-06
- Inventor: Parthiban Arunasalam , Siddharth Bhopte , Joe Albert Ojeda, Sr.
- Applicant: DunAn Microstaq, Inc
- Applicant Address: US TX Austin
- Assignee: DunAn Microstaq, Inc.
- Current Assignee: DunAn Microstaq, Inc.
- Current Assignee Address: US TX Austin
- Agency: MacMillan, Sobanski & Todd, LLC
- Main IPC: B23K1/20
- IPC: B23K1/20 ; B23K35/14
Abstract:
A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.
Public/Granted literature
- US20130175330A1 Method For Making A Solder Joint Public/Granted day:2013-07-11
Information query
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