Invention Grant
- Patent Title: Substrate supporting apparatus and substrate transporting apparatus with coupling magnets
- Patent Title (中): 基板支撑装置和具有联接磁体的基板输送装置
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Application No.: US13664769Application Date: 2012-10-31
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Publication No.: US08926258B2Publication Date: 2015-01-06
- Inventor: Koichi Yoshizuka , Satoshi Yamada
- Applicant: Canon Anelva Corporation
- Applicant Address: JP Kawasaki-shi
- Assignee: Canon Anelva Corporation
- Current Assignee: Canon Anelva Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2011-279259 20111221
- Main IPC: B25J15/00
- IPC: B25J15/00 ; B25J17/02 ; C23C14/50

Abstract:
A substrate supporting apparatus includes a substrate support that supports a substrate. A first connecting member is connected to the substrate support and includes a first magnet. A second connecting member faces the first connecting member and is connectable to a transport robot for transporting the substrate to a substrate holder. The second connecting member includes a second magnet magnetically coupled with the first magnet. A spacer is configured to hold an interval between the first connecting member and the second connecting member. The first connecting member and the second connecting member are relatively movable in a plane direction of the substrate via the spacer.
Public/Granted literature
- US20130164108A1 SUBSTRATE SUPPORTING APPARATUS AND SUBSTRATE TRANSPORTING APPARATUS Public/Granted day:2013-06-27
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