Invention Grant
- Patent Title: Undercut processing mechanism
- Patent Title (中): 底切加工机制
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Application No.: US14117725Application Date: 2012-01-11
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Publication No.: US08926316B2Publication Date: 2015-01-06
- Inventor: Masanori Sorimoto
- Applicant: Masanori Sorimoto
- Applicant Address: JP Hiroshima
- Assignee: Technocrats Corporation
- Current Assignee: Technocrats Corporation
- Current Assignee Address: JP Hiroshima
- Agency: Kubotera & Associates, LLC
- Priority: JP2011-160937 20110722
- International Application: PCT/JP2012/050359 WO 20120111
- International Announcement: WO2013/014952 WO 20130131
- Main IPC: B29C33/44
- IPC: B29C33/44 ; B29C45/44 ; B29C33/48 ; B22D17/22 ; B22D17/24

Abstract:
A pair of mold cores (51, 52) for molding an undercut portion (P1) in a holder (30) installed inside a movable mold (13) are connected to and supported by a retaining piece (40) which is moved in the demolding direction, and at the time of demolding, the respective mold cores (51, 52) are guided by guide means (33, 34) from the molding position, where they are contacted with each other, to the mold release position, where they are separated from each other, being moved from one end side to the other end side of the retaining piece (40), in the mutually opposite directions so as to pass each other in the back and forth direction.
Public/Granted literature
- US20140141115A1 UNDERCUT PROCESSING MECHANISM Public/Granted day:2014-05-22
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