A system for reconditioning a dental implant in situ comprising a buffer member, a drive member, abrasive material, and a sleeve member. The sleeve member moves between first and second positions relative to the buffer member. The buffer member is in an open configuration when the sleeve member is in the first position. The sleeve member holds the buffer member in a closed configuration when the sleeve member is in the second position. The buffer member is rotated such that the plurality of fingers of the buffer member cause the abrasive material to remove at least a portion of the texture layer on the textured portion of implant outer surface of the second implant portion.