Invention Grant
US08926337B2 Method for improving connector enclosure adhesion 有权
改善连接器外壳附着力的方法

Method for improving connector enclosure adhesion
Abstract:
An improved method is employed to attach an enclosure to a connector body having relatively small geometry. One or more bonding channels are disposed in the outside surface of the connector body. During assembly of an enclosure over the connector body, a bonding material is distributed within the bonding channels and subsequently cured. The bonding channels and the bonding material are designed to employ capillary wicking to aid in the distribution of the bonding material within the bonding channels.
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