Invention Grant
- Patent Title: Method for improving connector enclosure adhesion
- Patent Title (中): 改善连接器外壳附着力的方法
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Application No.: US13722887Application Date: 2012-12-20
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Publication No.: US08926337B2Publication Date: 2015-01-06
- Inventor: Edward Siahaan , Michael Webb
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01R11/30
- IPC: H01R11/30 ; H01R13/46 ; H01R43/00 ; H01R13/504 ; H01R24/60

Abstract:
An improved method is employed to attach an enclosure to a connector body having relatively small geometry. One or more bonding channels are disposed in the outside surface of the connector body. During assembly of an enclosure over the connector body, a bonding material is distributed within the bonding channels and subsequently cured. The bonding channels and the bonding material are designed to employ capillary wicking to aid in the distribution of the bonding material within the bonding channels.
Public/Granted literature
- US20140057496A1 METHOD FOR IMPROVING CONNECTOR ENCLOSURE ADHESION Public/Granted day:2014-02-27
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