A busway joint pack includes a first connector plate and a second connector plate that is spaced from the first connector plate such that the connector plates are configured to engage a pair of phase-conductors of a pair of busway sections. The busway joint pack further includes a first insulator assembly and a second insulator assembly. Each of the insulator assemblies includes a heat sink and two electrically insulating sheets on either major side surface of the heat sinks. The insulator assemblies are positioned adjacent to the connector plates such that the insulating sheets electrically insulate the heat sinks from the connector plates. Side panels are positioned adjacent to the heat sinks and abut end surfaces thereof to aid in transferring heat generated in the busway joint pack to the surrounding environment via the heat sinks and side panels.