Invention Grant
- Patent Title: High performance, small form factor connector with common mode impedance control
- Patent Title (中): 高性能,小尺寸连接器,具有共模阻抗控制
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Application No.: US13509452Application Date: 2010-11-12
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Publication No.: US08926377B2Publication Date: 2015-01-06
- Inventor: Brian Kirk , Vijay Kasturi
- Applicant: Brian Kirk , Vijay Kasturi
- Applicant Address: US CT Wallingford Center
- Assignee: Amphenol Corporation
- Current Assignee: Amphenol Corporation
- Current Assignee Address: US CT Wallingford Center
- Agency: Wolf, Greenfield & Sacks, P.C.
- International Application: PCT/US2010/056495 WO 20101112
- International Announcement: WO2011/060241 WO 20110519
- Main IPC: H01R13/502
- IPC: H01R13/502 ; H01R12/72

Abstract:
Techniques for improving electrical performance of a connector. The techniques are compatible with the form factor of a standardized connector, such as an SFP connector or stacked SFP. The resulting connector has reduced insertion loss for high speed signals. Such techniques, which can be used separately or together, include shaping of conductive elements within the connector while still retaining the same mating contact arrangement. Changes may be made at the contact tail portions or in the intermediate portions where engagement to a connector housing occurs. The techniques also include the incorporation of lossy bridging members between conductive elements designated to be ground conductors. For connectors according to the stacked SFP configuration, multiple bridging members may be incorporated at multiple locations within the connector.
Public/Granted literature
- US20130017733A1 HIGH PERFORMANCE, SMALL FORM FACTOR CONNECTOR WITH COMMON MODE IMPEDANCE CONTROL Public/Granted day:2013-01-17
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