Invention Grant
- Patent Title: Assembly of stent grafts with diameter reducing ties
- Patent Title (中): 具有直径减小关系的支架移植物的组装
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Application No.: US13795088Application Date: 2013-03-12
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Publication No.: US08926686B2Publication Date: 2015-01-06
- Inventor: Chantelle King
- Applicant: Cook Medical Technologies LLC
- Applicant Address: US IN Bloomington
- Assignee: Cook Medical Technologies LLC
- Current Assignee: Cook Medical Technologies LLC
- Current Assignee Address: US IN Bloomington
- Agent Richard J. Godlewski; Taiwoods Lin
- Priority: AU2012258395 20121127
- Main IPC: A61F2/07
- IPC: A61F2/07 ; A61F2/95 ; A61F2/06

Abstract:
A temporary diameter reduction constraint arrangement for a stent graft is disclosed. The arrangement comprises: primary and secondary release wires extending along the graft; a plurality of loops of thread, each loop engaged with either the primary or secondary wire and engaged around a portion of the graft circumferentially spaced away from its release wire, and drawn tight to reduce the diameter of the graft; an end constraint arrangement comprising four of the plurality of loops of thread arranged into a first and second pairs engaged with respective primary and secondary wires; and an intermediate constraint arrangement comprising a fifth and sixth of the plurality of loops of thread arranged into a third pair, the third pair engaged with the primary release wire, the primary release wire deviating towards the secondary release wire so as to locate the intermediate constraint arrangement substantially in-line with the end constraint arrangement.
Public/Granted literature
- US20140148895A1 ASSEMBLY OF STENT GRAFTS WITH DIAMETER REDUCING TIES Public/Granted day:2014-05-29
Information query
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