Invention Grant
US08926755B2 Lift-off deposition system featuring a density optimized HULA substrate holder in a conical deposition chamber
有权
剥离沉积系统，其特征是在锥形沉积室中具有密度优化的HULA衬底支架
- Patent Title: Lift-off deposition system featuring a density optimized HULA substrate holder in a conical deposition chamber
- Patent Title (中): 剥离沉积系统，其特征是在锥形沉积室中具有密度优化的HULA衬底支架
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Application No.: US12765005Application Date: 2010-04-22
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Publication No.: US08926755B2Publication Date: 2015-01-06
- Inventor: Ping Chang , Gregg Wallace
- Applicant: Ping Chang , Gregg Wallace
- Applicant Address: US CA Santa Clara
- Assignee: Ferrotec (USA) Corporation
- Current Assignee: Ferrotec (USA) Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Mesmer & Deleault, PLLC
- Agent Robert R. Deleault, Esq.
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C14/24 ; C23C14/04 ; C23C14/50
Abstract:
A vapor deposition device using a lift-off process includes an evaporation source, a support frame mounted for rotation about a first axis that passes through the evaporation source, a central dome-shaped wafer holder mounted to the support frame wherein a centerpoint of the central dome-shaped wafer holder is aligned with the first axis, an orbital dome-shaped wafer holder mounted to the support frame in a position offset from the first axis and rotatable about a second axis that passes through a centerpoint of the orbital dome-shaped wafer holder and the evaporation source, and a plurality of wafer positions on the central dome-shaped wafer holder and the orbital dome-shaped wafer holder where each of the wafer positions are offset from the first axis and the second axis.
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