Invention Grant
- Patent Title: Method and device for bonding two wafers
- Patent Title (中): 用于粘合两个晶片的方法和装置
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Application No.: US14113256Application Date: 2012-03-30
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Publication No.: US08926775B2Publication Date: 2015-01-06
- Inventor: Erich Thallner
- Applicant: Erich Thallner
- Agency: Kusner & Jaffe
- Priority: ATA666/2011 20110511
- International Application: PCT/EP2012/055840 WO 20120330
- International Announcement: WO2012/152507 WO 20121115
- Main IPC: B32B37/00
- IPC: B32B37/00 ; H01L21/71 ; H01L21/67 ; H01L21/18 ; H01L21/20
Abstract:
A device for bonding of two wafers on one joining surface V of the wafers. The device includes a pressure transfer means with a pressure surface D for applying a bond pressure to the two wafers on the pressure surface D, wherein the pressure surface D is smaller than the joining surface V. The invention also relates to a method for bonding of two wafers on one joining surface V of the two wafers, by pressure transfer means with a pressure surface D for action on the wafers (2, 3), wherein a bond pressure is applied in succession to partial sections of the joining surface V.
Public/Granted literature
- US20140196846A1 METHOD AND DEVICE FOR BONDING TWO WAFERS Public/Granted day:2014-07-17
Information query
