Invention Grant
- Patent Title: Method of fabricating patterned substrate
- Patent Title (中): 制作图案化基片的方法
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Application No.: US14048772Application Date: 2013-10-08
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Publication No.: US08927310B2Publication Date: 2015-01-06
- Inventor: Jeong Woo Park , Yoon Young Kwon , Kyungwook Park , Young Zo Yoo
- Applicant: Samsung Corning Precision Materials Co., Ltd.
- Applicant Address: KR Gumi-Si, Gyeongsangbuk-Do
- Assignee: Samsung Corning Precision Materials Co., Ltd.
- Current Assignee: Samsung Corning Precision Materials Co., Ltd.
- Current Assignee Address: KR Gumi-Si, Gyeongsangbuk-Do
- Agency: McDermott Will Emery LLP
- Priority: KR10-2012-0113235 20121012
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; H01L51/00 ; H01L51/44 ; H01L51/52
Abstract:
A method of fabricating a patterned substrate, with which the optical performance of a photovoltaic cell including an organic solar cell and an organic light-emitting diode (OLED) can be improved. The method includes generating electrostatic force on a surface of a substrate by treating the substrate with electrolytes, causing nano-particles to be adsorbed on the surface of the substrate, etching the surface of the substrate using the nano-particles as an etching mask, and removing the nano-particles residing on the surface of the substrate.
Public/Granted literature
- US20140106491A1 METHOD OF FABRICATING PATTERNED SUBSTRATE Public/Granted day:2014-04-17
Information query
IPC分类:
