Invention Grant
- Patent Title: High-throughput assembly of series interconnected solar cells
- Patent Title (中): 串联式太阳能电池的高通量装配
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Application No.: US13562712Application Date: 2012-07-31
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Publication No.: US08927315B1Publication Date: 2015-01-06
- Inventor: James R. Sheats , Werner Dumanski
- Applicant: James R. Sheats , Werner Dumanski
- Applicant Address: KY Grand Cayman
- Assignee: aeris CAPITAL Sustainable IP Ltd.
- Current Assignee: aeris CAPITAL Sustainable IP Ltd.
- Current Assignee Address: KY Grand Cayman
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Methods and devices are provided for high-efficiency solar cells. In one embodiment, an assembly is provided comprising of a plurality of solar cells each having at least one transparent conductor, a photovoltaic layer, at least one bottom electrode, a plurality of emitter wrap through (EWT) vias containing a conductive material, and a plurality of series interconnect vias containing a conductive material. The assembly may also include a backside support coupled to the solar cells, wherein the backside support is patterned to have electrically conductive areas and electrically nonconductive areas that create a series interconnect between solar cells electrically coupled by the support and prevents parallel connections between the solar cells. The cells may have a via insulating layer in each via separating the conductive material in each via from any side walls of the bottom electrode.
Information query
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