Invention Grant
US08927317B2 Method for producing a selective doping structure in a semiconductor substrate in order to produce a photovoltaic solar cell
有权
为了制造光伏太阳能电池,在半导体衬底中制造选择性掺杂结构的方法
- Patent Title: Method for producing a selective doping structure in a semiconductor substrate in order to produce a photovoltaic solar cell
- Patent Title (中): 为了制造光伏太阳能电池,在半导体衬底中制造选择性掺杂结构的方法
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Application No.: US13805111Application Date: 2011-06-16
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Publication No.: US08927317B2Publication Date: 2015-01-06
- Inventor: Ulrich Jager , Daniel Biro , Anne-Kristin Volk , Johannes Seiffe , Sebastian Mack , Andreas Wolf , Ralf Preu
- Applicant: Ulrich Jager , Daniel Biro , Anne-Kristin Volk , Johannes Seiffe , Sebastian Mack , Andreas Wolf , Ralf Preu
- Applicant Address: DE München DE Freiburg
- Assignee: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V.,Albert-Ludwigs-Universität Freiburg
- Current Assignee: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V.,Albert-Ludwigs-Universität Freiburg
- Current Assignee Address: DE München DE Freiburg
- Agency: Volpe and Koenig, P.C.
- Priority: DE102010024308 20100618
- International Application: PCT/EP2011/002965 WO 20110616
- International Announcement: WO2012/000612 WO 20120105
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L21/225 ; H01L21/268 ; H01L31/0224 ; H01L31/068

Abstract:
A method for producing a selective doping structure in a semiconductor substrate in order produce a photovoltaic solar cell. The method includes the following steps: A) applying a doping layer (2) to the emitter side of the semiconductor substrate, B) locally heating a melting region of the doping layer (2) and a melting region of the semiconductor substrate lying under the doping layer (2) in such a way that dopant diffuses from the doping layer (2) into the melted semiconductor substrate via liquid-liquid diffusion, so that a high doping region (3) is produced after the melt mixture solidifies, C) producing the planar low doping region by globally heating the semiconductor substrate, D) removing the doping layer (2) and E) removing or converting a layer of the semiconductor substrate on the doping side in such a way that part of the low doping region and of the high doping region close to the surface is removed or is converted into an electrically non-conducting layer.
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