Invention Grant
- Patent Title: Method of bonding by molecular bonding
- Patent Title (中): 通过分子键合键合的方法
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Application No.: US13380731Application Date: 2010-06-11
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Publication No.: US08927320B2Publication Date: 2015-01-06
- Inventor: Chrystelle Lagahe Blanchard , Marcel Broekaart , Arnaud Castex
- Applicant: Chrystelle Lagahe Blanchard , Marcel Broekaart , Arnaud Castex
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Priority: FR0954382 20090626
- International Application: PCT/EP2010/058244 WO 20100611
- International Announcement: WO2010/149512 WO 20101229
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L31/02 ; B32B37/10 ; H01L21/20
Abstract:
A method of bonding by molecular bonding between at least one lower wafer and an upper wafer comprises positioning the upper wafer on the lower wafer. In accordance with the invention, a contact force is applied to a peripheral side of at least one of the two wafers in order to initiate a bonding wave between the two wafers.
Public/Granted literature
- US20120164778A1 METHOD OF BONDING BY MOLECULAR BONDING Public/Granted day:2012-06-28
Information query
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