Invention Grant
US08927334B2 Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package 有权
克服芯片翘曲以增强焊料凸块的润湿和倒装芯片连接在倒装芯片封装中

Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package
Abstract:
Structures and methods for forming good electrical connections between an integrated circuit (IC) chip and a chip carrier of a flip chip package include forming one of: a tensile layer on a front side of the IC chip, which faces a tops surface of the chip carrier, and a compressive layer on the backside of the IC chip. Addition of one of: a tensile layer to the front side of the IC chip and a compressive layer the backside of the IC chip, may reduce or modulate warpage of the IC chip and enhance wetting of opposing solder surfaces of solder bumps on the IC chip and solder formed on flip chip (FC) attaches of a chip carrier during making of the flip chip package.
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