Invention Grant
- Patent Title: Stacked packaging improvements
- Patent Title (中): 堆叠包装改进
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Application No.: US14011086Application Date: 2013-08-27
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Publication No.: US08927337B2Publication Date: 2015-01-06
- Inventor: Belgacem Haba , Craig S. Mitchell , Masud Beroz
- Applicant: Tessera, Inc.
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/498 ; H01L23/00 ; H01L25/10
Abstract:
A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the leads project from this substrate. Lead frame (452) is joined to a further substrate (470) with one or more microelectronic elements (436, 404, 406) disposed between the substrates.
Public/Granted literature
- US20130344682A1 STACKED PACKAGING IMPROVEMENTS Public/Granted day:2013-12-26
Information query
IPC分类:
