Invention Grant
- Patent Title: Leadframe for electronic components
- Patent Title (中): 电子元件引线框架
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Application No.: US13124115Application Date: 2009-10-12
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Publication No.: US08927342B2Publication Date: 2015-01-06
- Inventor: Peter Goesele , Friedrich Seger , Josef Sinder , Joachim Stifter , Oliver Werner
- Applicant: Peter Goesele , Friedrich Seger , Josef Sinder , Joachim Stifter , Oliver Werner
- Applicant Address: DE Bensheim
- Assignee: Tyco Electronics AMP GmbH
- Current Assignee: Tyco Electronics AMP GmbH
- Current Assignee Address: DE Bensheim
- Agency: Faegre Baker Daniels LLP
- Priority: DE102008051491 20081013
- International Application: PCT/EP2009/063247 WO 20091012
- International Announcement: WO2010/043580 WO 20100422
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495
Abstract:
The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe.
Public/Granted literature
- US20110260304A1 LEADFRAME FOR ELECTRONIC COMPONENTS Public/Granted day:2011-10-27
Information query
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