Invention Grant
US08927345B2 Device package with rigid interconnect structure connecting die and substrate and method thereof
有权
具有连接管芯和衬底的刚性互连结构的器件封装及其方法
- Patent Title: Device package with rigid interconnect structure connecting die and substrate and method thereof
- Patent Title (中): 具有连接管芯和衬底的刚性互连结构的器件封装及其方法
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Application No.: US13544430Application Date: 2012-07-09
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Publication No.: US08927345B2Publication Date: 2015-01-06
- Inventor: Weng Foong Yap , Lai Cheng Law , Boh Kid Wong
- Applicant: Weng Foong Yap , Lai Cheng Law , Boh Kid Wong
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/4763
Abstract:
A method comprises fabricating an interconnect structure comprising a plurality of conductive interconnects encased in a dielectric structure and coupling each of the conductive interconnects to a corresponding bond pad of a package substrate and bond pad of a die. A device package comprises a substrate having a first plurality of bond pads disposed at a first surface of the substrate and a die having a first surface facing the first surface of the substrate and a second surface opposite the first surface, the die comprising a second plurality of bond pads disposed at the second surface. The device package further comprises an interconnect structure comprising a plurality of conductive interconnects encased in a dielectric structure, each of the conductive interconnects coupled to a corresponding bond pad of the first plurality of bond pads and to a corresponding bond pad of the second plurality of bond pads.
Public/Granted literature
- US20140008811A1 DEVICE PACKAGE WITH RIGID INTERCONNECT STRUCTURE CONNECTING DIE AND SUBSTRATE AND METHOD THEREOF Public/Granted day:2014-01-09
Information query
IPC分类:
