Invention Grant
- Patent Title: Manufacturing method of an active device substrate
- Patent Title (中): 有源器件衬底的制造方法
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Application No.: US14042869Application Date: 2013-10-01
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Publication No.: US08927394B2Publication Date: 2015-01-06
- Inventor: Tsung-Ying Ke
- Applicant: AU Optronics Corporation
- Applicant Address: TW Hsin-Chu
- Assignee: AU Optronics Corporation
- Current Assignee: AU Optronics Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW102115623A 20130501
- Main IPC: H01L21/46
- IPC: H01L21/46 ; H01L21/78 ; H01L21/301 ; H01L29/04 ; H01L29/12 ; H01L33/02
Abstract:
An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.
Public/Granted literature
- US20140327006A1 Active Device Substrate and Manufacturing Method Thereof Public/Granted day:2014-11-06
Information query
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