Invention Grant
US08927411B2 System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme
有权
用于形成铝熔断器的系统和方法，用于与铜BEOL互连方案兼容
- Patent Title: System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme
- Patent Title (中): 用于形成铝熔断器的系统和方法，用于与铜BEOL互连方案兼容
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Application No.: US14141559Application Date: 2013-12-27
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Publication No.: US08927411B2Publication Date: 2015-01-06
- Inventor: Felix P. Anderson , Timothy H. Daubenspeck , Jeffrey P. Gambino , Timothy S. Hayes , Donald R. Letourneau , Thomas L. McDevitt , Anthony K. Stamper
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/525
Abstract:
A semiconductor fuse device and a method of fabricating the fuse device including a last metal interconnect layer including at least two discrete metal conductors, an inter-level dielectric layer deposited over the last metal interconnect layer and the at least two discrete metal conductors, a thin wire aluminum fuse connecting the at least two discrete metal conductors, and a fuse opening above the aluminum fuse.
Public/Granted literature
- US20140106559A1 SYSTEM AND METHOD FOR FORMING AN ALUMINUM FUSE FOR COMPATIBILITY WITH COPPER BEOL INTERCONNECT SCHEME Public/Granted day:2014-04-17
Information query
IPC分类:
