Invention Grant
US08927429B2 Chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid
有权
包含特定杂多酸的化学机械抛光(CMP)组合物
- Patent Title: Chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid
- Patent Title (中): 包含特定杂多酸的化学机械抛光(CMP)组合物
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Application No.: US13877759Application Date: 2011-10-04
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Publication No.: US08927429B2Publication Date: 2015-01-06
- Inventor: Christine Schmitt , Andrey Karpov , Frank Rosowski , Mario Brands , Yuzhuo Li
- Applicant: Christine Schmitt , Andrey Karpov , Frank Rosowski , Mario Brands , Yuzhuo Li
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/IB2011/054357 WO 20111004
- International Announcement: WO2012/046185 WO 20120412
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/321 ; C09G1/02

Abstract:
A chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid Abstract A chemical-mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture thereof, (B) a heteropolyacid of the formula HaXbPsMOyVzOc wherein X=any cation other than H 8 0 and a>0 (formula I) or a salt thereof, and, (C) an aqueous medium.
Public/Granted literature
- US20130189842A1 CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING A SPECIFIC HETEROPOLYACID Public/Granted day:2013-07-25
Information query
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