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Invention Grant
US08927445B2 Sealing agent with low softening temperature useful in the preparation of electronic devices 有权
具有低软化温度的密封剂可用于制备电子设备

Sealing agent with low softening temperature useful in the preparation of electronic devices
Abstract:
The invention includes a composition for sealing agent, generally in the form of glass frit, lead-free, comprising by weight over the total weight of the composition: 30-80% Bi2O3; 2-10% ZnO; 2-10% B2O3; 0-5% Na2O; 1-10% SiO2; 1-8% Al2O3; 0-7% BaO; and 0-8% MgO. The composition for sealing agent as defined above can be added with a filler in a quantity up to 20% by weight over the total weight of the resulting mixture. The invention also includes a sealing paste containing the composition for sealing agent, the optional filler, an organic binder and optionally an organic solvent. The invention also includes methods for producing and using the composition for sealing agent and the sealing paste, as well as an electronic device sealed with the sealing paste.
Abstract(Chinese):

本发明包括通常以玻璃料形式的无铅的密封剂组合物，其含量超过组合物的总重量：30-80％Bi 2 O 3; 2-10％ZnO; 2-10％B2O3; 0-5％Na2O; 1-10％SiO2; 1-8％Al2O3; 0-7％BaO; 和0-8％MgO。 如上所述的密封剂组合物可以添加至所得混合物总重量的至多20重量％的填料。 本发明还包括含有密封剂组合物，任选的填料，有机粘合剂和任选的有机溶剂的密封膏。 本发明还包括用于生产和使用密封剂组合物和密封膏的方法，以及用密封膏密封的电子装置。

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