Invention Grant
- Patent Title: Suspension board with circuit and producing method thereof
- Patent Title (中): 具有电路的悬挂板及其制造方法
-
Application No.: US13763232Application Date: 2013-02-08
-
Publication No.: US08927870B2Publication Date: 2015-01-06
- Inventor: Yasushi Tamura , Ryouji Suezaki , Tetsuya Ohsawa , Hiroyuki Tanabe , Hitoki Kanagawa
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2009-052200 20090305
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/28 ; G11B5/48 ; G03F7/20 ; G03F1/00 ; H05K3/00 ; H05K1/05
Abstract:
A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
Public/Granted literature
- US08872036B2 Suspension board with circuit and producing method thereof Public/Granted day:2014-10-28
Information query
