Invention Grant
- Patent Title: Wiring board and method for manufacturing wiring board
- Patent Title (中): 接线板及制造接线板的方法
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Application No.: US13562508Application Date: 2012-07-31
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Publication No.: US08927875B2Publication Date: 2015-01-06
- Inventor: Toru Furuta , Fumitaka Takagi
- Applicant: Toru Furuta , Fumitaka Takagi
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN Co., Ltd.
- Current Assignee: IBIDEN Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/34 ; H05K1/02 ; H05K3/10 ; H05K1/11 ; H05K3/46
Abstract:
A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.
Public/Granted literature
- US20130192877A1 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD Public/Granted day:2013-08-01
Information query
