Invention Grant
US08927879B2 Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
有权
通过可变宽度网格平面结构在多层封装中的信号层之间的串扰降低
- Patent Title: Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
- Patent Title (中): 通过可变宽度网格平面结构在多层封装中的信号层之间的串扰降低
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Application No.: US12952152Application Date: 2010-11-22
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Publication No.: US08927879B2Publication Date: 2015-01-06
- Inventor: Jinwoo Choi , Sungjun Chun , Jason L. Frankel , Paul R. Walling , Roger D. Weekly
- Applicant: Jinwoo Choi , Sungjun Chun , Jason L. Frankel , Paul R. Walling , Roger D. Weekly
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Parashos T. Kalaitzis; Amy J. Pattillo
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/02 ; H05K1/02

Abstract:
A first selection of mesh line segments of a mesh layer are of a first width and a second selection of mesh line segments of the mesh layer are of a second width, wherein the second width is greater than the first width. The second selection of mesh line segments of the second width are positioned in parallel to a selection of signal lines in a signal layer that are likely to introduce crosstalk, wherein the widening of the mesh line segments shadowing the selection of signal lines increases the likelihood that the return current associated with the signal will flow in the wider mesh line segment, thereby increasing the likelihood of containing the electromagnetic fields associated with the signal such that crosstalk to other signals is reduced or contained.
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