Invention Grant
US08927900B2 Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device 有权
切割基板的方法,晶片状物体的处理方法以及半导体装置的制造方法

Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
Abstract:
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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