Invention Grant
- Patent Title: Thin film transistor substrate and method fabricating the same
- Patent Title (中): 薄膜晶体管基板及其制造方法
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Application No.: US13589172Application Date: 2012-08-19
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Publication No.: US08927983B2Publication Date: 2015-01-06
- Inventor: Wen-Chung Tang , Fang-An Shu , Yao-Chou Tsai , Ted-Hong Shinn
- Applicant: Wen-Chung Tang , Fang-An Shu , Yao-Chou Tsai , Ted-Hong Shinn
- Applicant Address: TW Hsinchu
- Assignee: E Ink Holdings Inc.
- Current Assignee: E Ink Holdings Inc.
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., Ltd.
- Priority: TW101111145A 20120329
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/12 ; H01L21/02 ; H01L21/00 ; H01L27/12
Abstract:
Disclosed herein is a thin film transistor array substrate. The thin film transistor array substrate includes a display area and a non-display area. The non-display area includes a signal line, a connecting line and a metal contact. The connecting line is formed in a first patterned metal layer. The signal line and the metal contact are formed in a second patterned metal layer. The connecting line is connected to the signal line by a first through-hole, and the connecting line is connected to the metal contact by a second through-hole. Furthermore, a method of fabricating the thin film transistor array substrate is also disclosed.
Public/Granted literature
- US20130105790A1 THIN FILM TRANSISTOR SUBSTRATE AND METHOD FABRICATING THE SAME Public/Granted day:2013-05-02
Information query
IPC分类:
