Invention Grant
- Patent Title: Edge termination by ion implantation in GaN
- Patent Title (中): 通过离子注入在GaN中的边缘终止
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Application No.: US13301165Application Date: 2011-11-21
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Publication No.: US08927999B2Publication Date: 2015-01-06
- Inventor: Isik C. Kizilyalli , Hui Nie , Andrew P. Edwards , Linda Romano , David Bour , Richard J. Brown , Thomas R. Prunty
- Applicant: Isik C. Kizilyalli , Hui Nie , Andrew P. Edwards , Linda Romano , David Bour , Richard J. Brown , Thomas R. Prunty
- Applicant Address: US CA San Jose
- Assignee: Avogy, Inc.
- Current Assignee: Avogy, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/265 ; H01L29/66 ; H01L29/808 ; H01L29/868 ; H01L29/872 ; H01L29/06

Abstract:
An edge terminated semiconductor device is described including a GaN substrate; a doped GaN epitaxial layer grown on the GaN substrate including an ion-implanted insulation region, wherein the ion-implanted region has a resistivity that is at least 90% of maximum resistivity and a conductive layer, such as a Schottky metal layer, disposed over the GaN epitaxial layer, wherein the conductive layer overlaps a portion of the ion-implanted region. A Schottky diode is prepared using the Schottky contact structure.
Public/Granted literature
- US20130126888A1 Edge Termination by Ion Implantation in GaN Public/Granted day:2013-05-23
Information query
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