Invention Grant
- Patent Title: Nitride semiconductor device
- Patent Title (中): 氮化物半导体器件
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Application No.: US13979090Application Date: 2011-10-26
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Publication No.: US08928003B2Publication Date: 2015-01-06
- Inventor: Katsunori Ueno , Shusuke Kaya
- Applicant: Katsunori Ueno , Shusuke Kaya
- Applicant Address: JP Tokyo JP Kanagawa
- Assignee: Furukawa Electric Co., Ltd.,Fuji Electric Co., Ltd.
- Current Assignee: Furukawa Electric Co., Ltd.,Fuji Electric Co., Ltd.
- Current Assignee Address: JP Tokyo JP Kanagawa
- Agency: Lowe, Hauptman & Ham, LLP
- Priority: JP2011-096618 20110422
- International Application: PCT/JP2011/074712 WO 20111026
- International Announcement: WO2012/144100 WO 20121026
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/423 ; H01L29/66 ; H01L29/20 ; H01L29/40 ; H01L29/778

Abstract:
The present invention prevents breakage of a gate insulating film of a MOS device and provides a nitride semiconductor device having improved reliability. An SBD metal electrode provided between a drain electrode and a gate electrode is configured to form a Schottky junction with an AlGaN layer. Further, the SBD metal electrode and a source electrode are connected and electrically short-circuited. Consequently, when an off signal is inputted to the gate electrode, a MOSFET part is turned off and the drain-side voltage of the MOSFET part becomes close to the drain electrode voltage. When the drain electrode voltage increases, the SBD metal electrode voltage becomes lower than the drain-side voltage of the MOSFET part, thus the drain side of the MOSFET part and the drain electrode are electrically disconnected by the SBD metal electrode.
Public/Granted literature
- US20130292699A1 NITRIDE SEMICONDUCTOR DEVICE Public/Granted day:2013-11-07
Information query
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