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Invention Grant
US08928008B2 Light emitting device package comprising a lead electrode exposed to a recessed bottom portion of the package body 有权
发光器件封装，包括暴露于封装主体的凹陷底部的引线电极

Light emitting device package comprising a lead electrode exposed to a recessed bottom portion of the package body
Abstract:
A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.
Abstract(Chinese):

提供发光器件封装。 发光器件封装包括封装主体，其包括第一腔体和连接到第一腔体的第二腔室; 第一引线电极，其至少一部分设置在所述第二腔内; 第二引线电极，其至少一部分设置在第一腔内; 设置在所述第二腔内的发光器件; 设置在所述第二腔内的第一线，所述第一线将所述发光器件电连接到所述第一引线电极; 以及将所述发光器件电连接到所述第二引线电极的第二线。

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