Invention Grant
- Patent Title: High efficiency module
- Patent Title (中): 高效率模块
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Application No.: US13771431Application Date: 2013-02-20
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Publication No.: US08928049B2Publication Date: 2015-01-06
- Inventor: Kenichi Yoshimochi
- Applicant: Rohm Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2007-205358 20070807
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01R9/00 ; H01L21/00 ; H05K7/14 ; H01L23/495 ; H01L23/00 ; H01L23/31

Abstract:
A module (1) includes a first functional device (2) and a second functional device (3). The first functional device (2) includes a base electrode, an emitter electrode and a collector electrode. The second functional device (3) includes at least one electrode. The module (1) further includes a conductive frame (4). One of the base electrode, the emitter electrode, and the collector electrode of the first functional device (2) is directly connected to the frame (4). The electrode of the second functional device (3) is also directly connected to the frame (4). The frame (4) includes a portion serving as a terminal for external connection.
Public/Granted literature
- US20130163211A1 HIGH EFFICIENCY MODULE Public/Granted day:2013-06-27
Information query
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