Invention Grant
- Patent Title: Electronic device including a schottky contact
- Patent Title (中): 包括肖特基接触的电子器件
-
Application No.: US13794103Application Date: 2013-03-11
-
Publication No.: US08928050B2Publication Date: 2015-01-06
- Inventor: Gary H. Loechelt , Prasad Venkatraman , Zia Hossain , Gordon M. Grivna
- Applicant: Gary H. Loechelt , Prasad Venkatraman , Zia Hossain , Gordon M. Grivna
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Abel Law Group, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L27/02

Abstract:
An electronic device can include a semiconductor layer having a primary surface, and a Schottky contact comprising a metal-containing member in contact with a horizontally-oriented lightly doped region within the semiconductor layer and lying adjacent to the primary surface. In an embodiment, the metal-containing member lies within a recess in the semiconductor layer and contacts the horizontally-oriented lightly doped region along a sidewall of the recess. In other embodiment, the Schottky contact may not be formed within a recess, and a doped region may be formed within the semiconductor layer under the horizontally-oriented lightly doped region and have a conductivity type opposite the horizontally-oriented lightly doped region. The Schottky contacts can be used in conjunction with power transistors in a switching circuit, such as a high-frequency voltage regulator.
Public/Granted literature
- US20140252484A1 Electronic Device Including a Schottky Contact Public/Granted day:2014-09-11
Information query
IPC分类: