Invention Grant
- Patent Title: Wiring structure, thin film transistor array substrate including the same, and display device
- Patent Title (中): 布线结构，薄膜晶体管阵列基板及其显示装置
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Application No.: US13653333Application Date: 2012-10-16
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Publication No.: US08928122B2Publication Date: 2015-01-06
- Inventor: Shingo Nagano , Takeshi Shimamura , Naruhito Hoka
- Applicant: Shingo Nagano , Takeshi Shimamura , Naruhito Hoka
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2011-245103 20111109
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L21/44
Abstract:
On a wiring conversion part connected to a first conductive film and a second conductive film each functioning as a wiring, a hollow portion is formed inside the second conductive film. A first transparent conductive film provided on the second conductive film is formed so as to cover an upper surface of the second conductive film and an end surface thereof exposed on the hollow portion, and so as not to cover an outer peripheral end surface of the second conductive film. A second transparent conductive film which is a layer above the first transparent conductive film is connected to the second conductive film and the first conductive film, so that the first conductive film and the second conductive film are electrically connected.
Public/Granted literature
- US20130113109A1 WIRING STRUCTURE, THIN FILM TRANSISTOR ARRAY SUBSTRATE INCLUDING THE SAME, AND DISPLAY DEVICE Public/Granted day:2013-05-09
Information query
IPC分类:
