Invention Grant
US08928130B2 Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same
有权
引线框架包括完全覆盖引线表面的绝缘树脂层和包括其的半导体器件
- Patent Title: Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same
- Patent Title (中): 引线框架包括完全覆盖引线表面的绝缘树脂层和包括其的半导体器件
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Application No.: US13848225Application Date: 2013-03-21
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Publication No.: US08928130B2Publication Date: 2015-01-06
- Inventor: Toshio Kobayashi , Hiroshi Shimizu , Toshiyuki Okabe , Yasuyuki Kimura , Kazutaka Kobayashi
- Applicant: Shinko Electric Industries Co., Ltd.
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Fish & Richardson P.C.
- Priority: JP2012-072110 20120327; JP2012-150495 20120704
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/36 ; H01L23/498 ; H01L21/48 ; H01L23/00 ; H01L25/065
Abstract:
A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.
Public/Granted literature
- US20130256854A1 LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD FRAME Public/Granted day:2013-10-03
Information query
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