Invention Grant
US08928133B2 Interlocking type solder connections for alignment and bonding of wafers and/or substrates
有权
用于对准和粘合晶片和/或基板的联锁型焊接连接
- Patent Title: Interlocking type solder connections for alignment and bonding of wafers and/or substrates
- Patent Title (中): 用于对准和粘合晶片和/或基板的联锁型焊接连接
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Application No.: US13465226Application Date: 2012-05-07
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Publication No.: US08928133B2Publication Date: 2015-01-06
- Inventor: Rajesh Baskaran
- Applicant: Rajesh Baskaran
- Applicant Address: US MA Lowell
- Assignee: M/A-COM Technology Solutions Holdings, Inc.
- Current Assignee: M/A-COM Technology Solutions Holdings, Inc.
- Current Assignee Address: US MA Lowell
- Agency: Christopher P. Maiorana, PC
- Main IPC: H01L29/72
- IPC: H01L29/72
Abstract:
An apparatus comprising a first substrate and a second substrate. The first substrate has disposed thereon a first feature. The second substrate has disposed thereon a second feature. The first feature is configured to interlock with the second feature such that the first substrate and the second substrate are aligned by the first and the second features within a predefined accuracy.
Public/Granted literature
- US20130292037A1 INTERLOCKING TYPE SOLDER CONNECTIONS FOR ALIGNMENT AND BONDING OF WAFERS AND/OR SUBSTRATES Public/Granted day:2013-11-07
Information query
IPC分类:
