Invention Grant
- Patent Title: Package on package bonding structure and method for forming the same
- Patent Title (中): 封装封装结合结构及其形成方法
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Application No.: US13916243Application Date: 2013-06-12
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Publication No.: US08928134B2Publication Date: 2015-01-06
- Inventor: Kuei-Wei Huang , Wei-Yu Chen , Meng-Tse Chen , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L23/538 ; H01L23/31 ; H01L21/56 ; H01L23/48
Abstract:
The described embodiments of mechanisms of forming a die package and package on package (PoP) structure involve forming a solder paste layer over metal balls of external connectors of a die package. The solder paste layer protects the metal balls from oxidation. In addition, the solder paste layer enables solder to solder bonding with another die package. Further, the solder paste layer moves an intermetallic compound (IMC) layer formed between the solder paste layer and the metal balls below a surface of a molding compound of the die package. Having the IMC layer below the surface strengthens the bonding structure between the two die packages.
Public/Granted literature
- US20140183732A1 PACKAGE ON PACKAGE BONDING STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2014-07-03
Information query
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